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Working condition, No missing配置
Software Ver. 2.50 Spindle Torque: l .8kW Chuck Table: None Spinner Table: 8 inch Porous Transport section Ionizer: None Blade attachment: No Flange Spinner cleaning Nozzle: 2-Fluid Nozzle UV mechanism: None Recognition Camera: CCD Utility: ITEM SPECIFICATION POWER 3WIRE+GROUND CUTTING WATER RC3/8 IR RC1/4 COOLING WATER(IN) RC1/4 COOLING WATER(OUT) RC1/4 EXHAUST DUCT ¢ 101.6mm DRAINAGE DUCT ¢ 50.6mmOEM 型号描述
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.文件
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DISCO
DFD6341
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
108439
晶圆尺寸：
8"/200mm
年份：
2017
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