说明
无说明配置
The tool was functional until late 2021 when the power supply died.OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
无文件
DISCO
DFL7340
已验证
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102766
晶圆尺寸：
未知
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFL7340
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102766
晶圆尺寸：
未知
年份：
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
The tool was functional until late 2021 when the power supply died.OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
无文件