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FULLY AUTOMATIC LASER SAW DFL7340 are for Sapphire 6inch in same process配置
无配置OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
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DISCO
DFL7340
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
69249
晶圆尺寸：
6"/150mm
年份：
2010
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说明
FULLY AUTOMATIC LASER SAW DFL7340 are for Sapphire 6inch in same process配置
无配置OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
无文件