说明
Laser Dicing Saw配置
无配置OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
无文件
DISCO
DFL7340
已验证
类别
Scribing, Cutting, Dicing
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
96645
晶圆尺寸：
6"/150mm
年份：
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFL7340
已验证
类别
Scribing, Cutting, Dicing
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
96645
晶圆尺寸：
6"/150mm
年份：
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Laser Dicing Saw配置
无配置OEM 型号描述
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.文件
无文件