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TEL / TOKYO ELECTRON TELFORMULA
    说明
    Type: TELFORMULA-1S-M Diffusion (Amorphous Anneal, ɑ-Si) Wafer Size: 300mm Vintage: 2009 S/W Version: 2.0
    配置
    Please see attached configuration
    OEM 型号描述
    TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
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    TEL / TOKYO ELECTRON

    TELFORMULA

    verified-listing-icon

    已验证

    类别
    Thermal Processing

    上次验证: 4 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    78754


    晶圆尺寸:

    12"/300mm


    年份:

    2009

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    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    TEL / TOKYO ELECTRON TELFORMULA

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    TELFORMULA

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    年份: 2003状况: 二手
    上次验证30 多天前

    TEL / TOKYO ELECTRON

    TELFORMULA

    verified-listing-icon
    已验证
    类别
    Thermal Processing
    上次验证: 4 天前
    listing-photo-c2319d012a0b4e1b89fbf01cc10b4a82-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/c2319d012a0b4e1b89fbf01cc10b4a82/34e1081381fb415fb540604b2813293f_d195138f7d8845c4b6d1f3fe204cbb9045005c_mw.jpeg
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    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    78754


    晶圆尺寸:

    12"/300mm


    年份:

    2009


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Type: TELFORMULA-1S-M Diffusion (Amorphous Anneal, ɑ-Si) Wafer Size: 300mm Vintage: 2009 S/W Version: 2.0
    配置
    Please see attached configuration
    OEM 型号描述
    TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.
    文件
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