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SUSS MicroTec / KARL SUSS

ABC200

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已验证
类别
Wafer Bonders
上次验证: 60 多天前
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物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

41224


晶圆尺寸:

8"/200mm


年份:

2006


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
AUTOMATED PRODUCTION WAFER BONDING SYSTEM
配置
无配置
OEM 型号描述
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
文件

无文件