说明
无说明配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
无文件
类似上架物品
查看全部
DISCO
DFG850
类别
Wafer Grinding
上次验证： 今天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
145092
晶圆尺寸：
未知
年份：
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
无文件