跳至主要内容
We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多

Moov logo

Moov Icon
LAM RESEARCH / SEZ DV-PRIME
  • LAM RESEARCH / SEZ DV-PRIME
  • LAM RESEARCH / SEZ DV-PRIME
  • LAM RESEARCH / SEZ DV-PRIME
说明
无说明
配置
无配置
OEM 型号描述
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
文件

无文件

PREFERRED
 
SELLER
类别
Wet Etch

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

126411


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

LAM RESEARCH / SEZ

DV-PRIME

verified-listing-icon
已验证
类别
Wet Etch
上次验证: 60 多天前
listing-photo-9b43594c21ff4081a88206f0ac6575dc-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

126411


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
无配置
OEM 型号描述
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.
文件

无文件