说明
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;配置
无配置OEM 型号描述
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文件
无文件
LAM RESEARCH / SEZ
DV-PRIME
已验证
类别
Wet Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
73723
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
DV-PRIME
类别
Wet Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
73723
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
1. Only the two on the right side of the 8 chambers of the entire machine can be used, while the other chambers cannot be used; 2. Only one of the four ports can be used, while the other three cannot be used; 3. Left ECO cannot be used; 4. 4 CDS, left 1 cannot be used, and the remaining 3 are normal;配置
无配置OEM 型号描述
The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.文件
无文件