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LAM RESEARCH / SEZ SP223
  • LAM RESEARCH / SEZ SP223
  • LAM RESEARCH / SEZ SP223
  • LAM RESEARCH / SEZ SP223
说明
POST METAL CLEAN - ST250
配置
无配置
OEM 型号描述
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.
文件

无文件

类别
Wet Etch

上次验证: 27 天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

128195


晶圆尺寸:

8"/200mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH / SEZ

SP223

verified-listing-icon
已验证
类别
Wet Etch
上次验证: 27 天前
listing-photo-f390e57d07f54dd0b1f34a06ad20807c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

128195


晶圆尺寸:

8"/200mm


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
POST METAL CLEAN - ST250
配置
无配置
OEM 型号描述
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.
文件

无文件