跳至主要内容
Moov logo

Moov Icon
LAM RESEARCH / SEZ SP223
    说明
    POST METAL CLEAN - ST250
    配置
    无配置
    OEM 型号描述
    The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.
    文件

    无文件

    类别
    Wet Etch

    上次验证: 26 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    128195


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH / SEZ

    SP223

    verified-listing-icon
    已验证
    类别
    Wet Etch
    上次验证: 26 天前
    listing-photo-f390e57d07f54dd0b1f34a06ad20807c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    128195


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    POST METAL CLEAN - ST250
    配置
    无配置
    OEM 型号描述
    The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.
    文件

    无文件