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ASM EAGLE XTREME GOCU
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder
    文件

    无文件

    类别
    Wire / Wedge / Ball Bonder

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    78431


    晶圆尺寸:

    未知


    年份:

    2014


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ASM

    EAGLE XTREME GOCU

    verified-listing-icon
    已验证
    类别
    Wire / Wedge / Ball Bonder
    上次验证: 60 多天前
    listing-photo-5eab240912554a4fb1a8a768e9e3bc4f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    78431


    晶圆尺寸:

    未知


    年份:

    2014


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire Bonder
    文件

    无文件