说明
Process: WIRE BONDER配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件
ASM
EAGLE XTREME
已验证
类别
Wire / Wedge / Ball Bonder
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114850
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME
类别
Wire / Wedge / Ball Bonder
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
114850
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Process: WIRE BONDER配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件