说明
Wire Bonder配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件
PREFERRED
SELLER
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106666
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
ASM
EAGLE XTREME
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106666
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wire Bonder配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件