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说明
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79163
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME
类别
Wire / Wedge / Ball Bonder
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79163
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件