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说明
WIRE BOND配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118074
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
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ASM
EAGLE XTREME
类别
Wire / Wedge / Ball Bonder
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
118074
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
WIRE BOND配置
无配置OEM 型号描述
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文件
无文件