说明
无说明配置
Including: Clamp, MarkⅡ Chamber *2 Endpoint & mini controller EBARA abatement system*2 EBARA Multi-stage dry pump Gas box Missing parts: ４ TC gauge/DRO/OPTO/AO(8115CPU))、 VDC power supply(15V) 1、RF match 2OEM 型号描述
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文件
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APPLIED MATERIALS (AMAT)
P5000 ETCH
已验证
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75275
晶圆尺寸：
6"/150mm
年份：
1992
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
P5000 ETCH
类别
Dry / Plasma Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75275
晶圆尺寸：
6"/150mm
年份：
1992
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Including: Clamp, MarkⅡ Chamber *2 Endpoint & mini controller EBARA abatement system*2 EBARA Multi-stage dry pump Gas box Missing parts: ４ TC gauge/DRO/OPTO/AO(8115CPU))、 VDC power supply(15V) 1、RF match 2OEM 型号描述
The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.文件
无文件