说明
Complete, working condtion配置
O2, Ar, CF4, SF6, CHF3. Can use H2 as well.OEM 型号描述
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.文件
无文件
类别
Dry / Plasma Etch
上次验证： 6 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
142297
晶圆尺寸：
未知
年份：
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PLASMATHERM
790
类别
Dry / Plasma Etch
上次验证： 6 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
142297
晶圆尺寸：
未知
年份：
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Complete, working condtion配置
O2, Ar, CF4, SF6, CHF3. Can use H2 as well.OEM 型号描述
The Plasma-Therm 790 series is a self-contained Reactive Ion Etching (RIE) system that features a showerhead gas distribution system and a water-cooled RF platen. This system is capable of etching silicon, silicon dioxide, and silicon nitride. The chamber can achieve a base pressure in the range of 3x10-5 Torr and can operate within a pressure range of 10mTorr to 100mTorr. The system is controlled by a PC and offers both manual and automatic operation modes. It has four process gases available: CF4, CHF3, SF6, and O2.文件
无文件