We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
SEZ - LAM Davinci DV-34BF Backside Wet Etch System 300 mm配置
无配置OEM 型号描述
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.文件
无文件
类别
Wet Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105212
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
LAM RESEARCH / SEZ
DV-34BF
类别
Wet Etch
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105212
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
SEZ - LAM Davinci DV-34BF Backside Wet Etch System 300 mm配置
无配置OEM 型号描述
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.文件
无文件