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LAM RESEARCH / SEZ DV-34BF
  • LAM RESEARCH / SEZ DV-34BF
  • LAM RESEARCH / SEZ DV-34BF
  • LAM RESEARCH / SEZ DV-34BF
说明
无说明
配置
4 Chambers
OEM 型号描述
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.
文件

无文件

类别
Wet Etch

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

22239


晶圆尺寸:

12"/300mm


年份:

2007


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LAM RESEARCH / SEZ

DV-34BF

verified-listing-icon
已验证
类别
Wet Etch
上次验证: 60 多天前
listing-photo-vnzpgno8__1vhoO5G64j3ISntmeOaYq5du3BnOmb77M-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

22239


晶圆尺寸:

12"/300mm


年份:

2007


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
4 Chambers
OEM 型号描述
The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.
文件

无文件